Keynote Speakers

 To be anounced.

Call For Papers       

The International Conference on Emerging Information Security and Applications (EISA) aims to provide a platform for researchers and practitioners across the world to exchange their ideas. It seeks original submissions that discuss practical or theoretical solutions to enhance the information and application security in practice.

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Topics of interest include, but are not limited to the ones listed below.

- Cyber intelligence techniques
- Multimedia security
- Blockchain and distributed ledger technology
- Malware and unwanted software
- Vulnerability analysis and reverse engineering
- Usable security and privacy
- Intrusion detection and prevention
- Authentication and access control
- Anonymity and privacy
- Cryptographic protection
- Digital forensics
- Cyber physical systems security
- Adversarial learning
- Security measurement
- Security management and policies
- Hardware and physical security

Important Dates

Submission Deadline	15 July 2023 (First Round)/15 September 2023 (Second Round)
Acceptance Notification	30 August 2023 (First Round)/10 October 2023 (Second Round)
Camera-ready Copy Due	30 October 2023
Conference	11-12 December 2023

Author Instructions

Authors are invited to submit original papers. All papers need to be submitted electronically through the website (https://easychair.org/conferences/?conf=eisa2023) with PDF format. Submitted papers must not substantially overlap with papers that have been published or that are simultaneously submitted to a journal or a conference with proceedings. Papers must be clearly presented in English, must not exceed 18 pages (and up to 20 pages with well-marked references and appendix) in Springer LNCS/CCIS format (https://www.springer.com/gp/computer-science/lncs/conference-proceedings-guidelines), including tables, figures, references and appendices. Papers will be selected based on their originality, significance, relevance, and clarity of presentation assessed by at least three reviewers. Submission of a paper should be regarded as a commitment that, should the paper be accepted, at least one of the authors will register and attend the conference to present the work. A best paper award will be granted.

Submission link will be updated later

The proceeding of this year's conference will be published by Springer (under confirmation). Author instructions and LaTeX/Word templates for LNCS/CCIS publications can be found via the following link.

Springer LNCS/CCIS Author Information

Journal Special Issues

Selected papers from EISA 2023 will be invited to consider submission (after significant extension) for special issues:

To be announced

Organising Committee

General Chairs

Anthony TS Ho, University of Surrey, UK
Rongxing Lu, University of New Brunswick, Canada
Fagen Li, University of Electronic Science and Technology of China, China

Program Chairs

Jun Shao, Zhejiang Gongshang University, China
Sokratis K. Katsikas, Norwegian University of Science and Technology, Norway
Weizhi Meng, Technical University of Denmark, Denmark

Publicity Chairs

Yunguo Guan, University of New Brunswick, Canada
Cong Zuo, Beijing Institute of Technology, China
Long Meng, University of Surrey, UK

Publication Chair

Wei-Yang Chiu, Technical University of Denmark, Denmark

Program Committee

Yunhe Feng, University of North Texas, USA
Stefanos Gritzalis, University of Piraeus, Greece
Debiao He, Wuhan University, China
Shoichi Hirose, University of Fukui, Japan
Chingfang Hsu, Central China Normal University, China
Xin Jin, The Ohio State University, USA
Wenjuan Li, The Hong Kong Polytechnic University, Hong Kong SAR, China
Gao Liu, Chongqing University, China
Xingye Lu, The Hong Kong Polytechnic University, Hong Kong SAR, China
Chunhua Su, University of Aizu, Japan
Je Sen Teh,Universiti Sains Malaysia, Malaysia
Zhe Xia, Wuhan University of Technology, China
Haiyang Xue, The Hong Kong Polytechnic University, Hong Kong SAR, China
Mingjun Wang, Xidian University, China
Qianhong Wu, Beihang University, China
Wun-She Yap, Universiti Tunku Abdul Rahman, Malaysia

Steering Committee

Jiageng Chen, Central China Normal University, China
Liqun Chen, University of Surrey, UK
Steven Furnell, University of Plymouth, UK
Anthony TS Ho, University of Surrey, UK
Sokratis K. Katsikas, Norwegian University of Science and Technology, Norway
Javier Lopez, University of Malaga, Spain
Weizhi Meng, Technical University of Denmark, Denmark

Accepted Papers

 Conference Schedule

 To be anounced.

 To be anounced.

Venue

EISA 2020 will be held associate with SpaCCS 2020 at Nanjing Golden Eagle Shangmei Hotel (No. 1688 Shuanglong Avenue, Jiangning District, Nanjing).

Location

Address: No. 1688 Shuanglong Avenue, Jiangning District, Nanjing, China.

Information on Visa Applications

All participants of ISPEC2018 should be very careful about visa requirements and should make travel plan in advance enough. Visitors are fully responsible for acquiring all documents needed for entering Japan.

Japan provides waiver of visa requirements with more than 60 countries and regions. Please refer to the recent status on the visa waiver program from the Ministry of Foreign Affairs of Japan (MOFA).

If you need a visa for attendance, you should prepare all required documents according to the visa information page by MOFA. If you have any questions, please contact diplomatic establishments of Japan in your residential area.

We will issue an invitation letter ONLY for those who have presentation(s) at ISPEC2018 upon request. If you need an invitation letter for visa application, please send the following documents to
(ispec2018-visa *at* ml.cc.tsukuba.ac.jp)
(please replace *at* with @.)
after paying the registration fee via ISPEC2018 website and fixing your accommodation during the conference. (You can download a copy of participation information sheet and schedules of stay sheet from here.)

• Filled participation information sheet for invitation letter (MS-word and PDF format).
• Photo-copy of your passport (PDF format). (The page which your photo and passport number are included.)
• Photo-copy of student identification card (PDF format), if you are student. (The page(s) which your photo, name, and ID number are included.)
• Photo-copy of employee identification card (PDF format), if you are an employee. (The page(s) which your photo, name, and ID number are included.)
• Filled schedules of your stay sheet (MS-word or PDF format) with a proof of your stay (e.g., a confirmation e-mail, a receipt or an invoice from your accommodation).

We will respond with a detailed procedure for invitation letter request. Please make sure to make a registration for ISPEC2018 before the request.

Notices:

• Visa application to MOFA may take a long time. Please do it well before the deadline!
• We will normally respond to the first request in a few days.
• After receiving all required information, we will normally handle your requests in 1 or 2 weeks and the letter will be sent by a postal mail.
• We do not issue any form of "a letter of guarantee"
• We will issue invitation letters only for those who have presentation(s) at ISPEC2018.
• We hold rights to request any additional information and/or to decline your application for invitation letters.
• In case you need a document to be submitted to your organization prior to applying Visa, just let us know immediately.
• Registration cannot be cancelled once the Visa application related documents have been sent out to you.

About privacy:

According to the Act on the Protection of Personal Information Held by Independent Administrative Agencies and others of Japan, the information submitted to ISPEC2018 in this page will be kept secret and used only for processing the invitation letter requests. In some cases, ISPEC2018 will share those information with a part of organizing committee members concerned for resolving issues (e.g. checking registration status and paper acceptance etc.). We will not use any information received for other purposes, except those required by laws and rules of Japan.

If you have any question, please contact: ispec2018-info@ml.cc.tsukuba.ac.jp